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Printed Circuit Board Projects

    TCE has Printed Circuit Board Design Engineers with extensive experience in Fabrication, Assembly and Test. Our Designers take pride in their ability to create the most complex designs without acceding to costly fabrication techniques. It is our philosophy that if there is a way to lower the cost and increase yields of any design, we will strive to achieve that goal. We provide full DFM packages with all files needed for a seamless transition into manufacturing.

Experience

          -        High density surface mount with active components on both sides

          -        High speed Backplanes/Midplanes with 28+ layers, 3 1/8 GPS

          -        XAUI, DDRII, SERDES, PCI-Express...

    Typical Designs Layout Statistics


  •    Components:  Placed(5068)  Unplaced(0)  Total(5070)
  •     Nets: W/Rats(4574)  No/Rats(43)  Total(4617)
  •     Pins: W/Rats(8757)  No/Rats(13280)    Total(22128)
  •     Equivalent ICs (1 pin = 1/14 EIC):  1580
  •     Router Keepin (in):(-0.6000,-0.2400) by (7.8900,14.2450)
  •     Layout area (sq in):  122.82
  •     Layout density (sq in/EIC):  0.078
  •     Pin density (Pins/sq in):  180.168
  •     Double-sided layout area (sq in):  245.64
  •     Double-sided layout density (sq in/EIC): 0.039                                       
  •     Double-sided pin density (Pins/sq in):  90.084
  •     Average ratlength (in):  -0.3
  •     Rat density (in/sq in):  -11.633
  •     Double-sided rat density (in/sq in):  -5.817
  •     Double-sided pin density (Pins/sq in):  90.084
  •     Average ratlength (in):  -0.3
  •     Rat density (in/sq in):  -11.633
  •     Double-sided rat density (in/sq in):  -5.817

Multi Gigabit Printed Circuit Board Design Projects

Customized 3U CPCIe Backplane
40Gb Stratix GX4 System Board

 

Customized 3U CPCIe Backplane
Customized 3U CPCIe Backplane

 

3U Conduction Cooled/Convection Cooled CPCIe Switch Fabric Card.
Conduction Cooled/Convection Cooled CPCIe Switch Fabric Card